| Shelfclass_id | 6.C |
| Sortkey | LAU, JOHN |
| Authors | John Lau, C.P. Wong, John L. Prince, Wataru Nakayama |
| Title | Electronic Packaging: Design, Materials, Process, and Reliability |
| Publisher | McGraw-Hill |
| Year | 1998 |
| Languages | eng |
| Isbn | 9780070371354 |
| Series | Electronic Packaging and Interconnection Series |
| Record date | 20230124 |