Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Shelfclass_id	6.A
Sortkey	HWANG, JENNIE S.
Authors	Jennie S. Hwang
Title	Solder Paste in Electronics Packaging: Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
Publisher	Van Nostrand Reinhold
Year	1989
Languages	eng
Isbn	9780442207540
Record date	20220325