International Symposium on Advances in Interconnection and Packaging: Book Two: Microelectronic Interconnects and Packages: System and Process Integration: 5-9 November 1990, Boston, Massachusetts.: Book 2

Shelfclass_id S/SPIE
Sortkey S/SPIE
Authors Stuart K. Tewksbury, John R. Carruthers, Alfred P. DeFonzo
Title International Symposium on Advances in Interconnection and Packaging: Book Two: Microelectronic Interconnects and Packages: System and Process Integration: 5-9 November 1990, Boston, Massachusetts.: Book 2
Publisher SPIE Optical Engineering Press
Year 1991
Languages eng
Isbn 0819404578
Series SPIE Proceedings
Volume 1390
Issn 99-0108644
Description x, 582 s.
Record date 20100810
Location Palos Verdes Estates, California
Keywords Elektronikpackning, Electronic packaging, Konferenspublikationer, Conference proceedings