Multichip Modules: International Conference and Exhibition: 1993 Proceedings: 14-16 April 1993, Denver, Colorado

Shelfclass_id S/SPIE
Sortkey S/SPIE
Authors SPIE
Title Multichip Modules: International Conference and Exhibition: 1993 Proceedings: 14-16 April 1993, Denver, Colorado
Publisher SPIE Optical Engineering Press
Year 1993
Languages eng
Isbn 0930815378
Series SPIE Proceedings
Volume 1986
Description 604 s.
Record date 20090828
Location Bellingham, Wash., USA
Keywords Multichip modules, Microelectronics, Multichip packaging, MCM technology, Elektronikpackning, Electronic packaging, Konferenspublikationer, Conference proceedings