Photonics Packaging and Integration IV: 29 January 2004, San Jose, California, USA

Shelfclass_id S/SPIE
Sortkey S/SPIE
Authors Randy A. Heyler, Ray T. Chen
Title Photonics Packaging and Integration IV: 29 January 2004, San Jose, California, USA
Publisher Spie
Year 2004
Languages eng
Isbn 0819452661
Series SPIE Proceedings
Volume 5358
Description vii, 168 p. ill. 28 cm.
Record date 20090821
Location Bellingham, Wash., USA
Keywords Optoelectronic devices, Microelectronic packaging, Optical interconnects, Photonics
Notes Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration