Multichip Modules: International Conference and Exhibition: 1994 Proceedings: 13-15 April 1994, Denver, Colorado

Shelfclass_id S/SPIE
Sortkey S/SPIE
Authors SPIE
Title Multichip Modules: International Conference and Exhibition: 1994 Proceedings: 13-15 April 1994, Denver, Colorado
Publisher SPIE Optical Engineering Press
Year 1994
Languages eng
Isbn 0930815394
Series SPIE Proceedings
Volume 2256
Description 630 s.
Record date 20090828
Location Bellingham, Wash., USA
Keywords Multichip modules, Microelectronics, Multichip packaging, MCM technology, Elektronikpackning, Electronic packaging, Konferenspublikationer, Conference proceedings