| Shelfclass_id | 6.B |
| Sortkey | JOHNSON, R. WAYNE |
| Authors | R. Wayne Johnson, Robert K. F. Teng, John W. Balde |
| Title | Multichip Modules: Systems Advantages, Major Constructions, and Materials Technologies |
| Publisher | IEEE Press |
| Year | c1991 |
| Languages | eng |
| Isbn | 087942267X |
| Series | IEEE press selected reprint series |
| Issn | 99-0106412 |
| Description | ix, 603 p. ill. 29 cm. |
| Record date | 20091204 |
| Location | New York |
| Keywords | Electronic packaging, Microelectronic packaging, Multichip modules (Microelectronics) |