| Shelfclass_id | 6.B |
| Sortkey | EMPC |
| Authors | Editor: Prabjit Singh |
| Title | EMPC 1991: Proceedings of the Fourth Electronic Materials and Processing Congress: Materials Developments in Microelectronic Packaging: Performance and Reliability |
| Publisher | ASM International |
| Year | 1991 |
| Languages | eng |
| Isbn | 0871704358 |
| Description | xi, 403 p. 29 cm |
| Record date | 20110630 |
| Location | Materials Park, Ohio |
| Keywords | Microelectronic packaging, Materials, Testing, Congresses |