Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications

Shelfclass_id 6.B
Sortkey BANERJEE, SWAGATA RIKI
Authors Swagata Riki Banerjee
Title Three Dimensional Wafer Level Interconnects for Integration in High Speed, Broadband Packaging and Circuit Applications
Publisher UMI
Year 2005
Languages eng
Isbn 0542310252
Record date 20070502
Location Ann Arbor, MI
Notes "A dissertation submitted to the faculty of the graduate school of the University of Minnesota [..] in partial fulfillment of the requirements for the degree of Doctor of Philosophy ."