Physical Design for Multichip Modules

Shelfclass_id 6.A
Sortkey SRIRAM, M
Authors M. Sriram, S. M. Kang
Title Physical Design for Multichip Modules
Publisher Kluwer Academic Publishers
Year c1994
Languages eng
Isbn 079239450X
Series The Kluwer international series in engineering and computer science
Volume 267
Description xi, 197 p. ill. 25 cm.
Record date 20090907
Location Boston
Keywords Electronic packaging, Multichip modules (Microelectronics)
Urlnote Table of contents only
Urls http://www.loc.gov/catdir/enhancements/fy0820/94001108-t.html